תגובות לפוסט: TSMC מעבירה פנימה פעילויות אריזה ובדיקות https://chiportal.co.il/tsmc-high-end-ic-packaging-impacts-outsourcers-0709116/?utm_source=rss&utm_medium=rss&utm_campaign=tsmc-high-end-ic-packaging-impacts-outsourcers-0709116 The Largest tech news in Israel – Chiportal, semiconductor, artificial intelligence, Quantum computing, Automotive, microelectronics, mil tech , green technologies, Israeli high tech, IOT, 5G Sun, 02 Feb 2020 20:20:38 +0000 hourly 1 https://wordpress.org/?v=6.5.5