Providing Israeli ASIC Customers Access to Best-in-Class Spec to Production Solutions
Taipei, Taiwan, Jerusalem, – April 27, 2014- Global Unichip Corporation (GUC), the Flexible ASIC LeaderTM, and Verisense Ltd, the leading ASIC development Services Company in Israel, announced today that they have entered into a strategic alliance to jointly provide turnkey ASIC services from architecture to manufacturing. The agreement also makes Verisense GUC’s representative in Israel
Both companies will exhibit togteher for the first time at the ChipEx2014 conference which will take place in Tel Aviv on April 30, 2014.
The new agreement is expected to hasten time-to-market through local interaction between design teams, while lowering risk for end customers. The agreement immediately opens Israeli ASIC access to TSMC most advanced process technologies through GUC’s close partnership with the foundry leader. It also provides easy access to GUC leading services on a wide range of technologies from BCD and Flash technologies to high end advanced technologies such as TSMC’s 16nm FinFet process.
The agreement also calls for access to GUC IP through Verisense and provides a full set of silicon proven SoC IP for all mainstream TSMC processes.
“Selecting Verisense was much more than choosing a local rep” said Yawlin Hwang, GUC VP of Sales and Marketing. “With their vast ASIC design service experience, and their outstanding reputation Verisense is the ideal partner for providing complete ASIC turn-key services”.
“Having worked with GUC for many years on a variety of very complex ASICs I know that they are extremely professional and their decision to become a significant player in Israel will bring many benefits to Israeli companies.” said Igor Elkanovich, Engineering and Technology lead at Verisense.
This alliance has already resulted in the first tape out of a jointly developed ASIC from Israel-based Spondoolies-Tech.
“Selecting Verisense and GUC as our design and manufacture partners was crucial to our success” said Guy Corem, CEO and Founder of Spondoolies-Tech. “Our chip was developed with power/performance much better than our competition while keeping the cost low and keeping to a very aggressive schedule. GUC succeeded to tape-out the ASIC just 9 weeks after the final netlist delivery by Verisense”.
“We believe that the combination of the GUC scale with the innovation of Israeli companies will result in great products.” said Yehuda Shaik, Verisense co-CEO. “We were impressed by GUC’s flexibility to adjust their flow and schedule to the customer needs, this is very important for Israeli customers”.
“Verisense’s level of customer service and their commitment to technology excellence are exactly the qualities we look for in all of our global partners,” explained JIm Lai, President of GUC.
Verisense, is the leading ASIC And FPGA design services company based in Israel. Verisense solves any design needs ranging from full turn-key solutions, to any aspect of the design including architecture, design, verification, backend services, post silicon system validation, FPGA prototyping and board design. Verisense customers range from the largest ASIC vendors in the world, through many of the top defense and aerospace companies, to early stage startups. Verisense has been involved in developments in the fields of wireline and wireless communication, Telecommunications, cellular, CPUs, graphic engines, imaging, aeronautical, space, RF, analog and mixed signal.
For more information, visit http://www.verisense.com/.
GLOBAL UNICHIP CORP. (GUC), is the Flexible ASIC LeaderTM who provides the semiconductor industry with leading IC implementation and SoC manufacturing services. Based in Hsin-chu Taiwan, GUC has developed a global reputation with a presence in China, Europe, Japan, Korea, and North America. GUC is publicly traded on the Taiwan Stock Exchange under the symbol 3443.
For more information, visit http://www.guc-asic.com/.