New Product launch at Chip-Ex 2012, Tel Aviv 2nd May 2012
Reltech launches its new 8000 series of High Power HTOL Systems designed for the High Temperature Operating Life Testing of low geometry semiconductor devices. The system is designed for use by Independent Test Houses and Semiconductor companies operating their own Quality & Reliability Laboratories.
Reltech 8014 HTOL System Features
Individual DUT Temperature Measurement & Control
iSocket™Technology
Open Rack – Room Temperature (RTBI) non chamber design
Easy to load trays on telescopic slides
DUT Monitoring with Auto shut down
Multi DUT type HTOL Testing
Remote System & HTOL monitoring
Today’s low geometry semiconductor devices require a different approach to performing High Temperature Operating Life (HTOL) and “Burn-In” testing. Core Leakage currents vary greatly between device die, even when from the same wafer and are significantly higher than those of larger geometry devices. These leakage currents result in self-heating within the device and increased junction temperatures (Tj).
In order to control the junction temperature to within acceptable limits and to increase product yield, it is necessary to control the temperature of each device independently. This is not possible in conventional chamber based HTOL systems. The Reltech 8000 series HTOL system incorporating iSocket™technology, provides the highest level of thermal control possible for High Temperature Operating Life Testing and Burn-In of the very latest low geometry semiconductor devices.
-For further information please contact
Mark Ashley
Tel: +44 (0) 1453 541200
m.ashley@reltech.co.uk
-Our representatives in Israel
Ehud Admati Agencies
Mr Udi Admati
Tel: +972 50 568 9866
udi@admati.com
Mr Ran Sagiv
Tel: +972 54 423 9784
ran@admati.com
